作者: Roderic C. Don , John W. Gillespie , Steven H. McKnight
DOI:
关键词: Adhesive bonding 、 Materials science 、 Composite material 、 Thermoplastic 、 Thermosetting polymer 、 Adhesive 、 Layer (electronics) 、 Polymer 、 Fabrication 、 Hardening (computing)
摘要: This invention is a new process to promote adhesion between thermoplastic polymers and thermosetting resin adhesives. accomplished by selecting third "interlayer" polymer which compatible with both the thermoset polymers. interlayer incorporated during fabrication provide finished part surface layer of film. Upon adhesive bonding, diffusion molecules into film occurs before complete cure, or hardening adhesive. After completion cure an Interpenetrating Network (IPN) formed. Molecular entanglement in this network provides superior strength enhancement.