Packaging apparatus for optical interconnection on optical printed circuit board
作者： Hyo-Hoon Park , Han-Seo Cho , Dong-Su Kim , Sun-tae Jung , Byung-Sup Rho
DOI:
关键词: Materials science 、 Optoelectronics 、 Optical communication 、 Printed circuit board 、 Optical interconnection 、 Substrate (printing) 、 Optically active 、 Block (telecommunications)
摘要: A packaging apparatus for optical interconnection on an PCB includes a first substrate with via hole formed therethrough and in which waveguide is formed, block having reflective plane its lower end inserted into the hole, second flip-bonded to upper surface of substrate, optically active element aligned communication.
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