The Redistributed Chip Package: A Breakthrough for Advanced Packaging
作者： Beth Keser , Craig Amrine , Trung Duong , Owen Fay , Scott Hayes
关键词: Flip chip 、 Computer hardware 、 Bumping 、 Chip 、 Engineering 、 Ball grid array 、 Quad Flat No-leads package 、 Chip-scale package 、 Package on package 、 Thermal copper pillar bump
摘要: … , the packaging is challenged to also integrate and shrink. Chips First or Embedded Chip packaging is a revolutionary wayto overcome these recent packaging integration challenges. …
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