Process for disengaging semiconductor die from an adhesive film
作者： Lup Kweun Yee , Darrell Jacob Belmas
DOI:
关键词: Materials science 、 Stress (mechanics) 、 Composite material 、 Process (computing) 、 Die (integrated circuit) 、 Adhesive
摘要: An apparatus and method for separating a semiconductor die (303) from an adhesive tape (32) are disclosed. The includes blade (34) mechanically coupled to holder (36), wherein the is inclined relative primary surface of (303). further comprises lifting while it attached assist disengagement. facilitates peeling distributing stress exerted on over larger area resulting in reduced fractures (20).
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