Moisture getting composition for hermetic microelectronic devices

摘要: This invention describes a composition of matter having moisture gettering properties and applicable as coating or adhesive in hermetic microelectronic device. The is applied to the interior surface packaging at thickness 0.1-25 mil comprises desiccant finely dispersed binder which water vapor permeable solid material. may be polymer, porous ceramic glass. particulate with 0.2-100 micrometer average particle size. It ought able absorb from one atmosphere pressure gas containing volume percent least four parts by weight per 100 25° C., for high reliability devices, it should also two 100° C. ratio between 0.002 2. Molecular sieves are especially useful component this invention.