Purging Deposition Tools to Reduce Oxygen and Moisture in Wafers
作者： Liu Yi Ying , Wang Yu Sheng , Nieh Chun Wen , Chen Wei Yu , Lin Yu Ting
DOI:
关键词: Moisture 、 Wafer 、 Optoelectronics 、 Deposition (phase transition) 、 Oxygen 、 Layer (electronics) 、 Materials science
摘要: A method includes placing a wafer in holder, the holder on loadport of deposition tool, connecting to front-end interface unit purging with nitrogen, and depositing metal layer tool.
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