Apparatus for liquid cooling of specific computer components

摘要: Apparatus is provided for a heat transfer assembly direct attachment to high generating chip, which includes pump, air side exchanger mounted adjacent fan and plate attached the component dissipating from such under operating conditions. In another embodiment, apparatus hard disk drive including U-shaped exchange clip resiliently on opposite surfaces of drive. generally rectangular mounting top or bottom And, in transferring vertical array drives, one more panels interposed between vertically disposed drives.