Expediting Transient Thermal Frequency Response Characterization and Sensitivity Analysis

摘要: This paper develops a technique, requiring no dedicated temperature sensing calibration step, to rapidly characterize transient heat transfer in packaged, power semiconductor components. It is presented as an alternative traditional step response characterization methods by exploiting the phase delay metric native frequency function (FRF) analysis field of system identification. The introduces electrothermal engineering steps needed design measurement system. presents aspects device physics and dynamic identify space which FRF data extracted from experiments are insensitive potential unknowns. Power electronic circuitry, providing needed, periodic actuation, probing, allowing for simple reconstruction post-processing, introduced. developed method leveraged in-lab make key confirming high-frequency-only thermal sensitivity component die-attach, highlighting opportunity achieve localized, converter degradation situ.