Accelerated life time test methods for new package technologies

作者: P. Nemeth

DOI: 10.1109/ISSE.2001.931061

关键词: Shock (mechanics)Nuclear engineeringEngineeringThermal shockReliability engineeringDynamic testingAccelerationCookerReliability (semiconductor)Highly accelerated stress testTemperature cycling

摘要: This paper describes some life time test methods, equipment and processes for evaluating the most important reliability parameters of new packaging technologies. Another goal is to introduce models acceleration. The commonly used stresses are: temperature-related accelerated test; temperature cycling; thermal shock, which can be more severe than cycling, as it has very fast ramp rates shorter cycle times; temperature, humidity bias (THB, 85/spl deg/C/85%RH); pressure cooker (PCT) unsaturated (USPCT); highly stress (HAST); nonaccelerated such vibration, etc. gives a detailed description effective economical HAST method.

参考文章(1)
P. Nemeth, Z. Illyefalvi-Vitez, G. Harsanyi, Review of the reliability of advanced component packaging technologies electronic components and technology conference. pp. 1605- 1609 ,(2000) , 10.1109/ECTC.2000.853430