作者: P. Nemeth
关键词: Shock (mechanics) 、 Nuclear engineering 、 Engineering 、 Thermal shock 、 Reliability engineering 、 Dynamic testing 、 Acceleration 、 Cooker 、 Reliability (semiconductor) 、 Highly accelerated stress test 、 Temperature cycling
摘要: This paper describes some life time test methods, equipment and processes for evaluating the most important reliability parameters of new packaging technologies. Another goal is to introduce models acceleration. The commonly used stresses are: temperature-related accelerated test; temperature cycling; thermal shock, which can be more severe than cycling, as it has very fast ramp rates shorter cycle times; temperature, humidity bias (THB, 85/spl deg/C/85%RH); pressure cooker (PCT) unsaturated (USPCT); highly stress (HAST); nonaccelerated such vibration, etc. gives a detailed description effective economical HAST method.