Ultracapacitor Package Design
作者： Todd Marshall Wetherill , Kamjula Pattabhirami Reddy
DOI:
关键词: Electronic engineering 、 Package design 、 Terminal (electronics) 、 Electrode 、 Mechanical engineering 、 Conductive materials 、 Bent molecular geometry 、 Supercapacitor 、 Engineering
摘要: A terminal plate for an ultracapacitor package is formed from a single sheet of conductive material and comprising plurality bent tabs extending in direction substantially orthogonal to first main surface the plate. The configured provide direct metallurgical contact between external terminals respective electrode set that incorporated into package.
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