Method for manufacturing a printed circuit board substrate

摘要: An inexpensive and high throughput process for manufacturing a printed circuit board (PCB) substrate includes first weaving plurality of electrically non-conductive strands (e.g., fiberglass yarns) at least one conductive strand copper wire) to form woven fabric with an upper surface lower surface. Next, the is impregnated resin material fabric, which then cured fabric. The surfaces are subsequently planed. planing step segments strand(s) forms PCB that planarized planed extending from Since each extends surface, function as vias substrate. Also, therein. integrally formed wire segments) were remainder substrates mechanical stability.