Interaction between nano-voids and migrating grain boundary by molecular dynamics simulation
作者： Liang Zhang , Yasushi Shibuta , Cheng Lu , Xiaoxu Huang
DOI: 10.1016/J.ACTAMAT.2019.05.020
关键词: Molecular dynamics 、 Grain boundary 、 Nano- 、 Chemical physics 、 Void (astronomy) 、 Materials science 、 Dissolution 、 Radiation resistant 、 Thermal diffusivity 、 Deformation mechanism
摘要: Understanding the interaction between void and grain boundary (GB) is important to the design of radiation resistant materials by GB engineering and to achieve high quality metallurgical diffusion joining. In this study, the interaction between nano-voids and GBs has been systematically investigated by molecular dynamics simulations. The bicrystal Cu sample was used throughout the work, and the dynamic GB-void interaction was achieved by GB migration under shear deformation. Both high-angle GBs (Σ5 (310) GB, Σ5 (210) GB) …
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