Effect of Substrate Preheating on Solderability Performance as a Guideline for Assembly Process Development Part 1: Baseline Analysis *

摘要: A study was performed which investigated the wettability of 63Sn‐37Pb and 96.5Sn‐3.5Ag solders on copper gold ‐nickel plated Kovar ™ using a rosin ‐based, mildly activated (RMA) flux, water soluble organic acid flux (WS ),and low residue (LR) flux. The quantitative metric contact angle, θc, measured by meniscometer /wetting balance technique. first part (Part 1) examined wetting performance following continuous exposure to 25°C prior testing. Then, preheating step introduced into experimental procedure after application, but preceding actual test in order simulate factory reflow process; these results are presented Part II this study. Contact angles for solder (215°C) were 22±2° with RMA 12±5° WS 31±6° LR Increasing temperature 245°C improved fluxes, no change observed fulx. Theii 96.5...