CONNECTION STRUCTURE OF ELECTRONIC PARTS AND MANUFACTURE THEREOF
作者： Kai Takanobu
DOI:
关键词: Electrical conductor 、 Composite material 、 Terminal (electronics) 、 Conductive materials 、 Particle 、 Connection (mathematics) 、 Soldering 、 Materials science
摘要: PROBLEM TO BE SOLVED: To improve connection reliability increasing the number of processes at time connecting fellow terminals a minute pitch by using an anisotropic conductive material. SOLUTION: At 3, 4 material, uneven part 6 having smaller difference in interval and height than diameter particle 1 is formed on top projection 2 for so as to check leak particles this surplus resin air bubbles generating during heating outside terminal. Thereby, only material remain reliability. The can be easily formation specific pattern 5a applying electrolytic soldering.
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