Selected aspects of epoxy adhesive compositions curing process

作者: Anna Rudawska , Monika Czarnota

DOI: 10.1080/01694243.2013.766558

关键词: Materials scienceCuring (chemistry)Composite materialAluminium alloyEpoxyCuring timeAdhesiveEpoxy adhesive

摘要: The paper focuses on selected parameters of curing process – temperature and time. tests aimed at evaluating the impact short-term thermal recuring 1050A 2017A aluminium alloy sheet adhesive joints strength. Joints were formed with two different adhesives, main component which was in both cases epoxy resin Epidian 53 cure agents poliamineamide C (PAC) triethylenetetraamine (PF) agents. Curing conditions first time, time modified for each four conducted. For sake comparative analysis, subjected to a single-stage cycle ambient temperature. A two-stage compositions 80 °C 1 2 h produces material mechanical properties than same submits temperature, as well 60 °C 30 min. Simultaneously, 53/PF/100:50 composition proves produce higher...

参考文章(42)
JAN GODZIMIRSKI, ANDRZEJ KOMOREK, MAREK ROSKOWICZ, Trwałość zmęczeniowa tworzywa Epidian 57 Polimery. ,vol. 53, pp. 737- 742 ,(2008) , 10.14314/POLIMERY.2008.737
M. Miller, W.A. MacDonald, R. Adam, Adhesion of UV-Cured Laminates of Poly(ethylene-2,6-naphthalate) (PEN) and Poly(ethylene terephthalate) (PET) films Journal of Adhesion Science and Technology. ,vol. 26, pp. 55- 78 ,(2012) , 10.1163/016942411X569282
MAGDALENA URBANIAK, KAROL GRUDZINSKI, Thermal investigations of curing process of EPY® epoxy system Polimery. ,vol. 49, pp. 89- 93 ,(2004) , 10.14314/POLIMERY.2004.089
M. Sadeghinia, K.M.B. Jansen, L.J. Ernst, Characterization and modeling the thermo-mechanical cure-dependent properties of epoxy molding compound International Journal of Adhesion and Adhesives. ,vol. 32, pp. 82- 88 ,(2012) , 10.1016/J.IJADHADH.2011.10.007
L. Merad, M. Cochez, S. Margueron, F. Jauchem, M. Ferriol, B. Benyoucef, P. Bourson, In-situ monitoring of the curing of epoxy resins by Raman spectroscopy Polymer Testing. ,vol. 28, pp. 42- 45 ,(2009) , 10.1016/J.POLYMERTESTING.2008.10.006
H Brockmann, M Haufe, J.O Schulenburg, Mechanism of the curing reaction of model epoxy compounds with monuron International Journal of Adhesion and Adhesives. ,vol. 20, pp. 333- 340 ,(2000) , 10.1016/S0143-7496(99)00066-4
Fabrice Lapique, Keith Redford, Curing effects on viscosity and mechanical properties of a commercial epoxy resin adhesive International Journal of Adhesion and Adhesives. ,vol. 22, pp. 337- 346 ,(2002) , 10.1016/S0143-7496(02)00013-1
Young Chang Nho, Phil Hyun Kang, Jong Seok Park, The characteristics of epoxy resin cured by γ-ray and E-beam Radiation Physics and Chemistry. ,vol. 71, pp. 243- 246 ,(2004) , 10.1016/J.RADPHYSCHEM.2004.03.047
Christian Perruchot, John F Watts, Chris Lowe, Graham Beamson, Characterisation of the curing temperature effects on polyester systems by angle-resolved XPS (ARXPS) International Journal of Adhesion and Adhesives. ,vol. 23, pp. 101- 113 ,(2003) , 10.1016/S0143-7496(02)00065-9