作者: Cornelius Marcus J. Mutsaers , Dagobert M. De Leeuw , Maurice Maria J. Simenon
DOI:
关键词: Printed circuit board 、 Substrate (printing) 、 Layer (electronics) 、 Polymer 、 Materials science 、 Conductive polymer 、 Electroplating 、 Composite material 、 Spin coating 、 Metallizing
摘要: A solution of monomers, oligomers or polymers and a suitable oxidation agent can be stable if the also comprises base. By spin coating this onto substrate, layer formed which, after patterned irradiation, yields pattern doped conductive polymer which is in situ, exposed unexposed areas exhibiting large difference conductivity. description given of, inter alia, irradiation 3,4-ethylenedioxythiophene. If desired, subsequently metallized an electroplating bath. The method provides, simple process manufacturing metal patterns on insulating substrates, such as printed circuit boards.