Carbon black dispersions as thermal pastes that surpass solder in providing high thermal contact conductance
作者： Chia-Ken Leong , D.D.L. Chung
DOI: 10.1016/S0008-6223(03)00247-1
关键词: Graphite 、 Thermal stability 、 Thermal contact 、 Carbon black 、 Ethyl cellulose 、 Materials science 、 Thermal contact conductance 、 Ethylene glycol 、 Thermal conductivity 、 Composite material
摘要: … The use of solder in place of a thermal paste as a thermal interface material gave a thermal … The limited effectiveness of solder occurs in spite of the high thermal conductivity of solder. …
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sci-hub.se 参考文章(46)
C A Smith, RUNNING-IN ADDITIVES AND SLURRIES: EFFECTS ON IMPROVED FUEL ECONOMY Automotive engineer. ,vol. 7, ,(1982)
P?K Khare, R?K Pandey, R?R Chourasia, P?L Jain, Transient and steady-state conduction in ethyl cellulose (EC)–poly(methyl methacrylate) (PMMA) blends Polymer International. ,vol. 49, pp. 719- 727 ,(2000) , 10.1002/1097-0126(200007)49:7<719::AID-PI445>3.0.CO;2-#
T. Sasaski, K. Hisano, T. Sakamoto, S. Monma, Y. Fijimori, H. Iwasaki, M. Ishizuka, Development of sheet type thermal conductive compound using AlN japan international electronic manufacturing technology symposium. pp. 236- 239 ,(1995) , 10.1109/IEMT.1995.541034
M. B. Bakaleinikov, E. M. Nikonorov, Rheological properties of high-temperature lubricating greases Chemistry and Technology of Fuels and Oils. ,vol. 18, pp. 108- 111 ,(1982) , 10.1007/BF00724958
P. K. Khare, Sandeep K. Jain, Sunil K. Paliwal, Ageing Effect on Ethyl Cellulose Films Polymer International. ,vol. 42, pp. 138- 142 ,(1997) , 10.1002/(SICI)1097-0126(199702)42:2<138::AID-PI654>3.0.CO;2-4
Ravi K. Srivastava, William P. Linak, Evaluation of carbon black slurries as clean burning fuels Fuel. ,vol. 73, pp. 1911- 1917 ,(1994) , 10.1016/0016-2361(94)90221-6
Xin Lu, Gu Xu, Peter G. Hofstra, Robert C. Bajcar, Moisture–absorption, dielectric relaxation, and thermal conductivity studies of polymer composites Journal of Polymer Science Part B. ,vol. 36, pp. 2259- 2265 ,(1998) , 10.1002/(SICI)1099-0488(19980930)36:13<2259::AID-POLB2>3.0.CO;2-O
E.G Wolff, D.A Schneider, Prediction of thermal contact resistance between polished surfaces International Journal of Heat and Mass Transfer. ,vol. 41, pp. 3469- 3482 ,(1998) , 10.1016/S0017-9310(98)00067-2
A. L. G. Saad, W. M. Sayed, M. G. M. Ahmed, A. M. Hassan, Preparation and properties of some filled poly(vinyl chloride) compositions Journal of Applied Polymer Science. ,vol. 73, pp. 2657- 2670 ,(1999) , 10.1002/(SICI)1097-4628(19990923)73:13<2657::AID-APP14>3.0.CO;2-7
K.N. Tu, Cu/Sn interfacial reactions: thin-film case versus bulk case Materials Chemistry and Physics. ,vol. 46, pp. 217- 223 ,(1996) , 10.1016/S0254-0584(97)80016-8