Ellipsometric study of silicon implanted with boron ions in low doses

作者: K. Watanabe , M. Miyao , I. Takemoto , N. Hashimoto

DOI: 10.1063/1.90848

关键词: Analytical chemistryRadiochemistrySiliconAnnealing (metallurgy)EllipsometryCrystallographic defectIonIon implantationMolar absorptivityMaterials scienceBoronPhysics and Astronomy (miscellaneous)

摘要: Ellipsometry was applied to estimate crystal damage in silicon caused by boron‐ion implantation low doses. A highly sensitive parameter for is proposed which derived from the extinction coefficient of complex refractive index. Crystal ion at doses as 3×1011 cm−2 and annealing effect on heat treatment dry N2 ambient after were clearly detected parameter.

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