Mechanical and Thermal Properties of Phenolic Foams Reinforced by Hollow Glass Beads

作者: Yu Xin Zuo , Zheng Jun Yao , Jin Tang Zhou

DOI: 10.4028/WWW.SCIENTIFIC.NET/AMR.988.13

关键词: Compressive strengthThermogravimetric analysisMaterials scienceThermal conductivity measurementComposite materialThermal stabilityCompression (physics)PorosityMolding (process)Thermal conductivity

摘要: Hollow glass beads / phenolic foam composites were prepared by molding method. The influence of HGB on thermal performance and mechanical properties of phenolic foams were investigated using thermal conductivity measurement, thermogravimetric analysis (TGA) and compression tester. The results show that the addition of hollow glass beads lead to a significant improvement in the compressive property of phenolic foams, with the compressive strength reaching the maximum adding 10% HGB and HGB pretreated by silicane coupling agent further enhance the compressive property. FT-IR spectroscopy shows the reaction between alcohol-OH groups on the surface of HGB and methoxy (-OCH3) groups on silane coupling agent (KH560). The morphology indicates the average cell size decreases with HGB content increasing up to 10%, and again the cell size of foams reinforced by pretreated HGB are better. Addition of HGB improved the thermal stability property of phenolic foams, due to the porosity was mainly responsible for thermal conductivity property of phenolic foams, so HGB filled materials achieved higher thermal conductivity.

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