Heat dissipation for electronic components
作者： John R. Saxelby , Patrizio Vinciarelli
DOI:
关键词: Dissipator 、 Printed circuit board 、 Electronic component 、 Path (graph theory) 、 Electrical engineering 、 Thermal management of electronic devices and systems 、 Thermal conductivity 、 Engineering 、 Electrical conductor
摘要: Heat is conducted, from a heat generating electronic device that mounted in gap between circuit board and dissipator, along path includes segment passes conductive runs on the another spans at location adjacent to device, other being spanned predominantly by non-metallic piece has thermal conductivity of least 7 W/m-°K.
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