Interconnect structures having tantalum/tantalum oxide layers
作者： Minas H. Tanielian , Kishore K. Chakravorty
DOI:
关键词: Copper 、 Electroplating 、 Composite material 、 Fabrication 、 Metallurgy 、 Polyimide 、 Substrate (electronics) 、 Layer (electronics) 、 Tantalum 、 Blanket 、 Materials science
摘要: A method of fabricating a high-density multilayer copper/polyimide interconnect structure utilizing blanket tantalum/tantalum oxide layer that electrically connects all the electroplating seed layers to edge substrate; upon completion process, excess is etched off produce isolated conductor lines. may be fabricated by repeating this fabrication sequence for each layer.
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