Method of forming fine conductive lines, patterns and connnectors

作者: Ming-Fea Chow , Frank B. Kaufman , William Lislie Guthrie

DOI:

关键词: Conductive materialsPolishingMaterials sciencePlanarComposite materialInsulator (electricity)Electrical conductorEngineering drawing

摘要: The present invention discloses a method of forming fine conductive lines, patterns, and connectors, is particularly useful in the formation electronic devices. comprises series steps which: polymeric material applied to substrate; patterned form openings through, spaces within, or combinations thereof material; subsequently, material, so that it at least fills existing excess removed from exterior major surface using chemical-mechanical polishing, expose material. structure remaining has planar surface, wherein filling becomes features such as connectors which are surrounded by may be left place an insulator removed, leaving on substrate.

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