作者: Ming-Fea Chow , Frank B. Kaufman , William Lislie Guthrie
DOI:
关键词: Conductive materials 、 Polishing 、 Materials science 、 Planar 、 Composite material 、 Insulator (electricity) 、 Electrical conductor 、 Engineering drawing
摘要: The present invention discloses a method of forming fine conductive lines, patterns, and connectors, is particularly useful in the formation electronic devices. comprises series steps which: polymeric material applied to substrate; patterned form openings through, spaces within, or combinations thereof material; subsequently, material, so that it at least fills existing excess removed from exterior major surface using chemical-mechanical polishing, expose material. structure remaining has planar surface, wherein filling becomes features such as connectors which are surrounded by may be left place an insulator removed, leaving on substrate.