作者: James E Morris , None
DOI:
关键词: Composite material 、 Flip chip 、 Nanocomposite 、 Microelectronics 、 Integrated circuit packaging 、 Carbon nanotube 、 Anisotropic conductive film 、 Nanoelectronics 、 Electronic packaging 、 Nanotechnology 、 Materials science
摘要: Nanotechnologies are being applied to microelectronics packaging, primarily in the applications of nanoparticle nanocomposites, or exploitation superior mechanical, electrical, thermal properties carbon nanotubes. Composite materials studied for high-k dielectrics, electrically conductive adhesives, "inks," underfill fillers, and solder enhancement. These trends demonstrated by paper presentations over past few years at ECTC other conferences, which show research be concentrated relatively laboratories, with little work done on packaging requirements new nanoelectronics technologies. Future needs (predictably) include education software development