System for connecting integrated circuit dies to a printed wiring board
作者： David B. Harris , Denise B. Harris , Robert A. Bourdelaise , Victor J. Brzozowski
DOI:
关键词: Electrical conductor 、 Printed circuit board 、 Integrated circuit 、 Electronic engineering 、 Die (manufacturing) 、 Integrally closed 、 Mechanical engineering 、 Electrical connector 、 Footprint (electronics) 、 Retainer 、 Engineering
摘要: Both a system and method are provided for electrically mechanically connecting at least one integrated circuit die to solderless printed wiring board of the type which uses interfaces include an array resilient electrical connector means held within sheet compliant, insulating material. The invention generally comprises fanout interface formed from material integrally connected side that includes bond pads associated with such dies, wherein internal contact die, external on its exterior surface advantageously spaced farther apart than die. further having connectors disposed between mounted directly board. Finally, screw-type heat conductive retainer is in order compress into conducting engagement
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