Preparation method of ceramic base printed circuit board used for light emitting diode (LED) installation

摘要: The invention provides a preparation method of ceramic base printed circuit board used for light emitting diode (LED) installation. LED installation comprises the following steps: S1, providing an aluminum substrate, forming organic material with first through hole, and binder layer second hole; S2, sequentially overlapping board, ensuring that hole are in one-to-one correspondence, blind groove installation, wherein bottom surface is substrate; S3, placing overlapped pressing device then hot-pressing, therefore acquired, buffer which hot-pressing temperature resistant on one side substrate process hot-pressing. By fragmentation caused under locally uneven stress can be restrained, quality products improved.