High power radiation emitter device and heat dissipating package for electronic components
作者： Spencer D. Reese , John K. Roberts
DOI:
关键词: Thermal 、 Radiation 、 Materials science 、 Semiconductor 、 Common emitter 、 Resistor 、 Optoelectronics 、 Electronic component 、 Thermal contact 、 Electrical conductor
摘要: The electronic component package of the present invention includes a sealed chamber; liquid or gel contained in at least one disposed chamber physical and thermal contact with gel; electrical conductor electrically coupled to extending out said chamber. component(s) may include any combination radiation emitter, optical sensor, resistor, microprocessor other semiconductor component.
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