DEPOSITION OF ADHERENT DLC FILMS USING A LOW-COST ENHANCED PULSED-DC PECVD METHOD

摘要: DLC films are usually obtained by plasma decomposition of a hydrocarbon-rich atmosphere using PECVD technique. insulating requires the substrates to be powered with an alternating pulse. A summary degree hardness, friction coefficient, deposition rate, total stress, adherence, and structural properties as function pulsed-DC voltage presented. Si(100), Ti6Al4V alloy, stainless steel were used substrates. Microindentation was measure hardness on thin films. The coefficient critical load determined tribometer. conventional profilometry technique stress thickness. film microstructure studied means Raman scattering spectroscopy. results show that deposited low-cost EP-DC method provided best overall results, presenting very high adherence different substrates, low over large area at reasonable growth rate.