Plug-in module for electronic device having self-contained heat sink

作者： Larry V. Douglass , Jack E. Jones , Pasquale Ambruoso

DOI:

关键词: Substrate (printing) 、 Electronic engineering 、 Terminal (electronics) 、 Header 、 Electronic circuit 、 Base (geometry) 、 Heat sink 、 Mechanical engineering 、 Engineering 、 Chassis 、 Ground

摘要: A small plug-in module includes a combined housing and heat sink, terminals cooperating with mating on chassis. The guiding structure to facilitate insertion of the chassis, which may also form for providing ground connection module. an electronic circuit components, at least one develops substantial heat, such as transistor. components are positioned substrate is mounted in conducting relation base housing. and/or sides constructed provide sufficient mass dissipate developed by components. housing-heat sink have recesses into spring inserts placed resiliently engage pins extending from chassis guide position thereto. Alternatively, terminal can be secured sockets header provided contacts extend connect grounding facilitates engagement more fragile contacts.