作者: Bruce M. McWilliams , Irving P. Herman , Fred Mitlitsky , Roderick A. Hyde , Lowell L. Wood
DOI: 10.1063/1.94191
关键词: Semiconductor device 、 Wafer 、 Optoelectronics 、 Integrated circuit 、 Substrate (electronics) 、 Field-effect transistor 、 Transistor 、 Tungsten 、 Materials science 、 Electronic circuit 、 Physics and Astronomy (miscellaneous)
摘要: A complete set of processes sufficient for manufacture n‐metal‐oxide‐semiconductor (n‐MOS) transistors by a laser‐induced direct‐write process has been demonstrated separately, and integrated to yield functional transistors. Gates interconnects were fabricated various combinations n‐doped intrinsic polysilicon, tungsten, tungsten silicide compounds. Both 0.1‐μm 1‐μm‐thick gate oxides micromachined with without etchant gas, the exposed p‐Si [100] substrate was cleaned and, at times, etched. Diffusion regions doped pyrolytic decomposition phosphine followed laser annealing. Along successful working n‐MOS elementary digital logic gates, this letter reports use several surface reactions that have not reported previously.