Printed circuit arrangement.
作者： Heather Pilcher
DOI:
关键词: Inkwell 、 Copper 、 Conductive polymer 、 Electroless deposition 、 Substrate (printing) 、 Printed circuit board 、 Nickel 、 Soldering 、 Materials science 、 Composite material
摘要: A circuit arrangement is formed by producing a pattern of conductive polymer ink upon moulded plastics substrate. When cured the treated with palladium compound to promote electroless deposition copper or nickel on ink. Solder can then be applied without damaging
lens.org 参考文章(2)
Charles W. Eichelberger, Robert J. Wojnarowski, Fabrication of electrical conductor by replacement of metallic powder in polymer with more noble metal ,(1980)
Merwin F. Hoover, Jan Vandebult, Ann B. Salamone, Composite product having patterned metal layer and process ,(1984)