Method and system for analyte determination in metal plating baths
作者： Hugh E. Gotts , Jay Jung , Josh H. Golden , Marc Van Den Berg
DOI:
关键词: Raman spectroscopy 、 Analyte 、 Metallurgy 、 Copper plating 、 Absorbance 、 Metal 、 Plating 、 Inorganic chemistry 、 Penetration depth 、 Electrolyte 、 Chemistry
摘要: The present invention relates generally to the field of electrolytic and electroless metal plating. A method system for determining presence analytes in plating solutions using Raman spectroscopy is described. High absorbance bath samples are analyzed by minimizing penetration depth incident light beam. chemical auto-dosing controlling concentration one or more additives a also provided.
lens.org 参考文章(12)
John Houman, Electrolytic copper plating solutions ,(1983)
William J. Willis, Electrodeposition of copper, acidic copper electroplating baths and additives therefor ,(1981)
Roger F. Bernards, Patrick Houle, Gordon Fisher, Wade Sonnenberg, Copper electroplating solutions and processes ,(1991)
Sylvia Martin, Alkoxylated dimercaptans as copper additives and de-polarizing additives ,(1996)
John Michael Fildes, Robert Harold Krueger, Cutting tool wear monitor ,(1986)
Momcilo Miljkovic, Copper electroplating solutions and methods of making and using them ,(1987)
Bin Zhao, Yosi Schacham-Diamand, Prahalad K. Vasudev, Valery M. Dubin, Chiu H. Ting, Use of cobalt tungsten phosphide as a barrier material for copper metallization ,(1996)
Daniel Charles Edelstein, Judith Marie Rubino, George Frederick Walker, Cyryl Cabral, Carlos Juan Sambucetti, John G Gaudiello, Horatio Seymour Wildman, Method for forming Co-W-P-Au films ,(2001)
Kwang-Ja Park, Jung-Il Park, Method for the deposition of diamond film on an electroless-plated nickel layer ,(1994)