Copper thick film conductor composition
作者： Masatoshi Suehiro , Masashi Echigo , Yutaka Mitsune , Masami Sakuraba , Tsutomu Nishimura
DOI:
关键词: Materials science 、 Solderability 、 Copper 、 Borosilicate glass 、 Substrate (chemistry) 、 Borate glass 、 Particle size 、 Conductor 、 Zinc 、 Metallurgy
摘要: A copper-containing thick film conductor composition comprising 55 to 95% by weight of an inorganic powder and 45 5% organic medium, said 100 parts a copper powder, 0.05 3 zinc oxide 1 7 lead borate glass 0.2 5 borosilicate 0 10 snboxide having average particle size not more than 1.0 μm. The the present invention is excellent in solderability adhesive strength substrate.
lens.org 参考文章(7)
Charles C. Y. Kuo, Terry R. Bloom, Copper conductive paint for porcelainized metal substrates ,(1985)
Vincent P. Siuta, Joel Slutsky, Copper conductor compositions ,(1983)
James D. Mitchell, Copper conductor compositions containing copper oxide and Bi2 O3 ,(1978)
Joseph R. Rellick, Mixed oxide bonded copper conductor compositions ,(1979)
Satoru Yuhaku, Toru Ishida, Tsutomu Nishimura, Seiichi Nakatani, Thick film conductor composition ,(1986)
Mitchell James D, Copper conductor compositions containing copper oxide and Bi{hd 2{b O{HD 3{B -based glass ,(1979)
Vincent Paul Siuta, Thick film conductor compositions ,(1983)