Apparatus for Transferring Broadband, High-Frequency Signals
作者： Qi Chen , Bernhard Michalski
DOI:
关键词: Materials science 、 Coupling 、 Optics 、 Wavelength 、 Galvanic isolation 、 Signal 、 Electrical engineering 、 Line (electrical engineering) 、 Conductor 、 Substrate (printing) 、 Broadband
摘要: An apparatus for the transfer of broadband, high-frequency signals a center wavelength (λ c ), including conductor structure, which includes at least one signal path and two reference paths arranged symmetrically to path. Together structure form coplanar line, with being on oppositely lying sides dielectric substrate layer predetermined thickness in such manner that overlaps coupling regions, whereby region transfers by an electromagnetic coupling, wherein ( 18 ) is smaller than λ /4, multiple couplings are serially after other. The enables galvanic isolation having good properties case frequencies greater 6 GHz.
lens.org 参考文章(7)
Christopher A. Moye, Joseph N. Owens, Space-saving two-sided microwave circuitry for hybrid circuits ,(1990)
Peter M. Compton, Staggered ground-plane microstrip transmission line ,(1986)
John V. Bellantoni, John S. Tobias, Connector assembly for detachably connecting a printed wiring board to a coaxial transmission lines connector ,(1996)
Junichi Somei, Transmission circuit using strip line in three dimensions ,(1997)
Hidehiro Minamiue, Kenji Kitazawa, Naoyuki Shino, Akira Nakayama, Koichi Nagata, Shinichi Koriyama, Takanori Kubo, Shigeki Morioka, Masanobu Ishida, High-frequency module coupled via aperture in a ground plane ,(1999)
Alex Margomenos, Microstrip-to-microstrip RF transition including co-planar waveguide connected by vias ,(2005)
Maraki Maetani, Wiring substrate for high frequency applications ,(2001)