作者: Yimin Yao , Xiaoliang Zeng , Kun Guo , Rong Sun , Jian-bin Xu
DOI: 10.1016/J.COMPOSITESA.2014.10.027
关键词: Composite material 、 Thermal conductivity 、 Materials science 、 Graphene 、 Glass fiber 、 Composite number 、 Polymer 、 Dielectric 、 Epoxy 、 Fibre-reinforced plastic
摘要: … Rapidly increasing packaging density of electronic devices puts forward higher requirements for … way to develop high-performance GFRP composites with high thermal conductivity for …