Preparation and properties of W–Cu–Zn alloy with low W–W contiguity

作者: Ling-Ling Zheng , Jin-Xu Liu , Shu-Kui Li , Shuang Liu , Qing-He Zou

DOI: 10.1007/S12598-015-0570-X

关键词: Relative densityCopper platingTungstenAlloyMaterials scienceMetallurgySinteringIndentation hardnessMicrostructureSpark plasma sintering

摘要: The W–Cu–Zn alloy with α-brass matrix and low W–W contiguity was prepared by method of electroless copper plating combined spark plasma sintering (SPS) method. effects process parameters on the microstructure mechanical properties were investigated. a relative density 96 % about 10 % original fine tungsten particles wet mixing SPS solid-state at 800 °C for 10 min. analysis shows that Cu–Zn consists nano-sized grains, main composition is Cu3Zn electride. Cu coated surface method, fairly consolidation temperature short time result in phase. dynamic compressive strength achieves to 1000 MPa, but poor ductility due formation hard brittle electrides. fine-grain strengthening solution phase are responsible high Vickers microhardness 300 MPa alloy.

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