Electrochemical fabrication methods for producing multilayer structures including the use of diamond machining in the planarization of deposits of material

摘要: Electrochemical fabrication methods for forming single and multilayer mesoscale microscale structures are disclosed which include the use of diamond machining (e.g. fly cutting or turning) to planarize layers. Some embodiments focus on systems sacrificial structural materials useful in can be machined with minimal tool wear Ni—P Cu, Au Cu Sn, Sn—Pb), where first material second is material). reducing when using being electrochemically fabricated difficult-to-machine by depositing difficult machine selectively potentially little excess plating thickness, and/or pre-machining depositions within a small increment desired surface level lapping rough operation) then complete he process, portions from thin walled regions hard-to-machine as opposed wide solid material.