Thermal transport structure and associated method

作者: Sandeep Shrikant Tonapi , Ryan Christopher Mills , Arun Virupaksha Gowda , Jian Zhang

DOI:

关键词: Conductive materialsComposite materialMaterials scienceElectrical conductorThermal transportLayer (electronics)Thermal conduction

摘要: A thermal transport structure having a layer and resin is provided. The may include first surface second surface, thermally conductive material disposed in the layer, where oriented predetermined direction order to facilitate heat conduction relative direction. Further, secured relatively less than layer.

参考文章(14)
Shlomo D. Novotny, Marlin R. Vogel, Integrated circuit component temperature gradient reducer ,(2000)
Kevin A. Mccullough, Thermally conductive composite material ,(1999)
Michael Lee Warddrip, Robert Angelo Mercuri, Joseph Paul Capp, Thomas William Weber, Flexible graphite article and method of manufacture ,(2000)
Martin R. Pais, Detlef Schmidt, Hybrid substrate for cooling an electronic component ,(1997)
Kevin M. McNab, Carl W. Peterson, M. Akbar Ali, Electronic structure having an embedded pyrolytic graphite heat sink material ,(1999)
Gary D. Shives, Martin David Smalc, Robert Anderson Reynolds, Thermal solution for electronic devices ,(2004)
Raymond A Bochman, Robert J Russell, James H Shane, Flexible graphite material of expanded particles compressed together ,(1963)