Transducer transfer stack
作者： Johannes Wilhelmus Weekamp , Cornelis Gerardus Visser , Willem-Jan Arend De Wijs
DOI:
关键词: Adhesive 、 FOIL method 、 Transfer (computing) 、 Layer (electronics) 、 Composite material 、 Stack (abstract data type) 、 Electrical engineering 、 Transducer 、 Materials science 、 Adhesion 、 Substrate (printing)
摘要: The invention relates to a transfer stack (TS) for transferring portion of foil within perimeter (P) that includes transducer (T) an article (A) such as medical device or needle. carrier substrate (CS), (F) having incorporated therein, and the is laterally surrounded by (P). separable from (CS) overcoming first peel retaining force (PRF1). An adhesive layer (AL) also attached foil. configured provide adhesion between when via surface second (PRF2). (PRF2) greater than
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