Device module and method of manufacturing the device module
作者： Koji Shinoda , Takeshi Isoda
DOI:
关键词: External connection 、 Engineering drawing 、 Engineering 、 Mechanical engineering 、 Die (integrated circuit)
摘要: The invention provides a device module capable of preventing plastic material from flowing into housing recess die for part the external connection and facilitating to be inserted die. A method manufacturing is also provided. includes 200, touch sensor 300 embedded in holder 500 an 400 connected partially fixed 500. has exposed portion 520 200 thickness direction D1 such manner as close 12 lead-out 420 insertable led through out D1.
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