Disconnect cavity by plating resist process and structure

摘要: A disconnect cavity is formed within a PCB, where the electrically disconnected from PCB landing layer. The using plating resist process which does not require low flow prepreg nor selective copper etching. Plating printed on core structure selectively positioned stack-up. volume occupied by forms subsequently cavity. After lamination of stack-up, depth control milling, drilling and electroless are performed, followed stripping to substantially remove all plated resist, thereby forming In subsequent process, without electric connectivity cannot be side walls bottom surface cavity, resulting in wall being