作者: David A. Mindell , Gregory L. Charvat
DOI:
关键词: Chip 、 Electrical engineering 、 Radio frequency 、 Antenna (radio) 、 Substrate (printing) 、 Center frequency 、 Materials science
摘要: A device comprising: a substrate; semiconductor die mounted on the transmit antenna fabricated substrate and configured to radio-frequency (RF) signals at least first center frequency; receive RF second frequency different than circuitry integrated with provide from antenna.