Method for forming conductive bumps for the purpose of contrructing a fine pitch test device

摘要: A system is described for using with fine pitch devices including singulated bare die, semiconductor wafers, chip sized packages, printed circuit boards, and the like to determine that device not faulty. The also usable transfer of data, energy, collecting data measurements or measurement-related between two pieces, effecting at least part an identification process. disclosed embodiment includes a substrate having pad pattern in mirror image contact points, usually bond pads be connected. conductive elastomeric probe permanently formed on such malleable allows repetitive electrical contact. may contain alignment template orienting onto probes point substrate.