Inner lead bonding inspecting method and inspection apparatus therefor
作者： Kazuyuki Yamanaka , Mitsusada Shibasaka
DOI:
关键词: Materials science 、 Semiconductor 、 Measured quantity 、 Irradiation 、 Inner lead bonding 、 Optics 、 Planar 、 Electrode 、 Measurement device
摘要: An inner lead bonding inspecting method comprises the steps of: irradiating an illumination light onto planar surface of a portion between electrode bump provided on semiconductor pellet and lead, measuring quantity reflected from surface, judging whether state is good or bad basis measured result. According to another aspect, apparatus any irradiation device for lead; measurement comparing with reference quantity, judge quality state.
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