Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatus
作者： Masahiko Furuno , Kazuhide Doi , Tsugunori Masuda , Hideo Aoki
DOI:
关键词: Electrode 、 Gas supply 、 Materials science 、 Vacuum chamber 、 Irradiation 、 Soldering 、 Plasma 、 Treatment method 、 Flux (metallurgy) 、 Metallurgy
摘要: Process gas is fed from a supply means to plasma generating in vacuum chamber, and hydrogen-containing generated by the under low pressure. A soft solder alloy on surface of workpiece supported exposing exposed so that irradiated with plasma. Either simultaneously or immediately after irradiation, undergoes reflow treatment heating means. As no flux used, there need washing process, bump-shaped electrode terminals produced using inexpensive have great reliability.
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