Fast capacitance extraction in multilayer, conformal and embedded dielectric using hybrid boundary element method

摘要: In modern VLSI circuits, metal conductors are separated by multiple planar, conformal or embedded dielectric media. Previous algorithms based on Boundary Element Method (BEM) inefficient to extract interconnect capacitance due the complex structures. this paper, we present a new algorithm that combines multilayer Green's function with equivalent charge method efficiently deal dielectrics. The is efficient model layered media, while powerful non-planar dielectric. Our can also ground plane and reflective boundary wall. From experimental results, significantly faster than previous methods in realistic conditions, i.e., 70X speedup 99% memory saving compared FastCap 2X 80% PHiCap for structure similar accuracy.