A Study of Thin Film Resistors Prepared Using Ni-Cr-Si-Al-Ta High Entropy Alloy

作者: Ruei-Cheng Lin , Tai-Kuang Lee , Der-Ho Wu , Ying-Chieh Lee

DOI: 10.1155/2015/847191

关键词: Temperature coefficientAmorphous solidMicrostructureMaterials scienceSputteringThin filmCarbon filmAnalytical chemistryAuger electron spectroscopyAnnealing (metallurgy)

摘要: … It is generally found that high entropy alloys form simple solid solution structures (rather than many complex phases) at elevated temperatures because of large mixing entropies. The …

参考文章(29)
邦宏 松田, 超精密金属皮膜抵抗器 (電子部品 ) -- (性能・信頼性向上) National technical report. ,vol. 26, pp. 283- 291 ,(1980)
Ming-Hung Tsai, Jien-Wei Yeh, High-Entropy Alloys: A Critical Review Materials research letters. ,vol. 2, pp. 107- 123 ,(2014) , 10.1080/21663831.2014.912690
D S Campbell, B Hendry, The effect of composition on the temperature coefficient of resistance of NiCr films British Journal of Applied Physics. ,vol. 16, pp. 1719- 1725 ,(1965) , 10.1088/0508-3443/16/11/315
MI Birjega, CA Constantin, I Th Florescu, C Sarbu, Crystallization of amorphous sputtered 55%Cr-45%Ni thin films Thin Solid Films. ,vol. 92, pp. 315- 322 ,(1982) , 10.1016/0040-6090(82)90154-7
W. Isler, L. Kitchman, Influence of Deposition and Processing Parameters on the TCR of Ni-Cr-Cu-Al ALloy Film Resistors IEEE Transactions on Parts, Materials and Packaging. ,vol. 5, pp. 139- 146 ,(1969) , 10.1109/TPMP.1969.1136070
Simone Taioli, C Cazorla, MJ Gillan, D Alfè, None, Melting curve of tantalum from first principles Physical Review B. ,vol. 75, pp. 214103- ,(2007) , 10.1103/PHYSREVB.75.214103
Chun Ng, Sheng Guo, Junhua Luan, Sanqiang Shi, Chain Tsuan Liu, None, Entropy-driven phase stability and slow diffusion kinetics in an Al0.5CoCrCuFeNi high entropy alloy Intermetallics. ,vol. 31, pp. 165- 172 ,(2012) , 10.1016/J.INTERMET.2012.07.001
Min-Chul Jun, Jung-Hyuk Koh, Effects of Annealing Temperature on Properties of Al-Doped ZnO Thin Films prepared by Sol-Gel Dip-Coating Journal of Electrical Engineering & Technology. ,vol. 8, pp. 163- 167 ,(2013) , 10.5370/JEET.2013.8.1.163