High Temperature Polymers For Electronic Devices
作者： J. Economy
DOI: 10.1007/978-1-4613-2759-2_14
关键词: Polyamic acid 、 IBM 、 Polymer 、 Nanotechnology 、 Electronics 、 Microelectronics 、 Materials science 、 Dielectric
摘要: In this paper, the potential advantages of polymers as dielectric insulating layers in advanced microelectronic devices are described along with requirements for their use chips. Some key results obtained from a detailed study polyimides carried out within IBM summarized efforts aimed at optimizing polyamic acid precursor to achieve improved processibility. Finally, some preliminary work on new type high temperature polymer that appears satisfy many shortcomings existing systems.
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