Method and apparatus for conditioning a polishing pad with sonic energy
作者： Robert G. Boehm , Helmuth Treichel , Michael S. Lacy , Alan J. Jensen , Allan M. Radman
DOI:
关键词: Wafer 、 Energy (signal processing) 、 Engineering 、 Acoustics 、 Polishing 、 Mechanical engineering 、 Transducer
摘要: A method and apparatus for conditioning a polishing pad is described, wherein the has surface semiconductor wafer. The includes positioning sonic energy generator above of pad, applying to pad. adapted be positioned surface, including transducer, liquid carrier in flow communication with transducer transmits into applied belt.
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