Method of manufacturing a semiconductor device with an isolation region and a device manufactured by the method

作者: Jan Sonsky

DOI:

关键词: EngineeringEtching (microfabrication)OptoelectronicsTrenchActive devicesSi substrateIsolation (database systems)Semiconductor deviceElectronic engineeringShallow trench isolationLayer (electronics)

摘要: A method of manufacturing a semiconductor device includes forming trench isolation structures, exposing some the structures 28 to leave others 30 masked, and then selectively etching buried layer form cavity 32 under an active region 34 . The is supported by support regions in exposed trenches may be SiGe on Si substrate.

参考文章(10)
Tae Moon Roh, Jong Dae Kim, Yil Suk Yang, Byoung-Gon Yu, II-Young Park, Sang Gi Kim, Dae Woo Lee, Semiconductor device having heat release structure using soi substrate and fabrication method thereof ,(2002)
Stephen J. Gaul, Anthony L. Rivoli, Jose Avelino Delgado, William R. Young, Patrick A. Begley, Integrated circuit air bridge structures and methods of fabricating same ,(1997)
Ichiro Mizushima, Hisato Oyamatsu, Takashi Yamada, Tsutomu Sato, Hajime Nagano, Shinichi Nitta, Semiconductor chip having multiple functional blocks integrated in a single chip and method for fabricating the same ,(2004)
Masakatsu Tsuchiaki, Method for silicon island formation ,(1996)
Jyu-Horng Shieh, Bor-Shyang Lin, Chao-Cheng Chen, Chia-Shiung Tsai, Jen-Cheng Liu, Process for improving copper fill integrity ,(2000)
Stéphane Monfray, Sébastien Cremer, Christophe Regnier, Philippe Delpech, Process of making integrated electronic circuit with stacked elements and corresponding integrated electronic circuit. ,(2004)