作者: John E. McConnell , Alan Webster , John Bultitude , Lonnie Jones
DOI:
关键词: Sphere packing 、 Multiplicity (chemistry) 、 Optoelectronics 、 Engineering 、 Electronic component 、 Electrical engineering 、 Electrical contacts
摘要: A stacked leaded array is provided wherein the allows for increased packing density of electronic components. The has a multiplicity components in array. Each component comprises first termination and second termination. leads are each lead electrical contact with at least one Second terminations.